Vitopel present at the Circuit of Conferences FISPAL / ABRE

July 20, 2017

The 33rd edition of Fispal Tecnologia – International Technology Fair for the Food and Beverage Industry, held at São Paulo Expo, in São Paulo, took place on June 27 and 30, 2017.

With the participation of large companies, micro and small manufacturers, Fispal Tecnologia was the stage for conducting business and networking among buyers of the food and beverage, chemical and pharmaceutical industry sectors, and national and international suppliers of machines, software, automation, labels, scales, processors up to forklifts, conveyors and conveyors, among other products.

The fair brought together businessmen, executives and professionals from the entire production chain of the food and beverage industries. In this environment, we have demonstrated innovative products and services, sustainable, aligned with the concept of lower cost. Knowledge, solutions, trends, business fulfillment and networking, all in one place.

Vitopel Presence

Thiago Balbino, Product Development Analyst and Mônica Telfser, Development and Innovation Coordinator, were invited to participate in the Lecture Circuit held at the fair through ABRE – Brazilian Association of Packaging.

Focused on BOPP Development and Innovation Projects, Vitopel professionals presented the BOPP Vitopel HIS-Film Project with higher sealing strength and impact and with modified elasticity. The main idea of ​​HIS is to meet packages that have mechanical demands superior to a conventional BOPP and that for this today they are used of laminated structures, such as BOPP + PPcast or BOPP + PE.

The product, with a patent application in 2014, promises with its new concept, to reduce a lamination process and thereby decrease the weight of the final packaging, providing yield gain and promoting a significant reduction in the use / disposal of packaging / plastic in the medium environment and thereby offer the market opportunities for sustainable development.

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